Patent Assignment
Reel/Frame 030858/0865
Assignment of Assignor's Interest
Recorded: 2013-07-23
Pages: 8
Assignors
KIM, HYUNGOCK
Executed: 2013-07-01
KIM, WOOK
Executed: 2013-07-01
SEOMUN, JUN
Executed: 2013-07-01
OH, CHUNGKI
Executed: 2013-07-01
JEON, JAEHAN
Executed: 2013-07-01
DO, KYUNGTAE
Executed: 2013-07-01
CHOI, JUNGYUN
Executed: 2013-07-01
WON, HYOSIG
Executed: 2013-07-02
KIM, KEE SUP
Executed: 2013-07-02
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
System on Chip and Temperature Control Method Thereof