Assignment of Assignor's Interest

Recorded: 2013-07-31 Pages: 5

Assignors

UEDA, AKIRA

Executed: 2013-07-11

TAKAHASHI, KENICHI

Executed: 2013-07-11

FUJII, ATSUSHI

Executed: 2013-07-11

KAWAMURA, TETSUYA

Executed: 2013-07-11

Assignee

NIPPON VALQUA INDUSTRIES, LTD.

1-1, OSAKI 2-CHOME, SHINAGAWA-KU, TOKYO, 1416024, JAPAN

Covered Property (1)

Sealing Material for Thin Plate Member

Patent: 9,077,010 →

Application: 13/982,875 →

Publication: US 2013/0307227

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.