Patent Assignment
Reel/Frame 030916/0001
Assignment of Assignor's Interest
Recorded: 2013-07-31
Pages: 7
Assignors
KIM, JI HWANG
Executed: 2013-06-21
MIN, TAE HONG
Executed: 2013-06-25
JO, CHAJEA
Executed: 2013-06-21
CHO, TAEJE
Executed: 2013-06-25
JEE, YOUNG KUN
Executed: 2013-06-25
CHOI, YUNSEOK
Executed: 2013-06-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, JAPAN
Covered Property
(1)
Semiconductor Packages, Methods of Manufacturing the Same, and Semiconductor Package Structures Including the Same