Patent Assignment
Reel/Frame 030926/0078
Assignment of Assignor's Interest
Recorded: 2013-08-01
Pages: 4
Assignors
CHOU, BRUCE C.S.
Executed: 2013-01-21
LIN, CHIH-HSIEN
Executed: 2013-01-24
LU, HSIANG-TAI
Executed: 2013-01-23
TU, JUNG-KUO
Executed: 2013-01-21
HSIEH, TUNG-HUNG
Executed: 2013-01-23
LIN, CHEN-HUA
Executed: 2013-01-23
LIU, MINGO
Executed: 2013-01-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Package Structure and Methods of Forming Same