IP Library › Assignment 030943/0564
Patent Assignment
Reel/Frame 030943/0564

Assignment of Assignor's Interest

Recorded: 2013-08-05 Pages: 6
Assignor
OCCAM PORTFOLIO LLC
Executed: 2013-06-28
Assignee
FJELSTAD, JOSEPH CHARLES
28121 231ST PLACE SE, MAPLE VALLEY, WASHINGTON, 98038
Covered Properties (15)
A Method of Making a Circuit Assembly
Patent: 7,926,173 →
Application: 12/163,870 →
Publication: US 2009/0008140
Electronic Assemblies Without Solder and Methods for Their Manufacture
Patent: 8,510,935 →
Application: 12/170,426 →
Publication: US 2009/0017264
Electronic Assemblies Without Solder Having Overlapping Components
Patent: 8,300,425 →
Application: 12/184,086 →
Publication: US 2009/0034219
Light Emitting Diode Package Assembly
Patent: 8,067,777 →
Application: 12/190,464 →
Publication: US 2009/0278139
Electronic Assemblies Without Solder and Methods for Their Manufacture
Patent: 7,981,703 →
Application: 12/191,544 →
Publication: US 2008/0297985
Method of Making a Circuit Subassembly
Patent: 9,681,550 →
Application: 12/200,749 →
Publication: US 2009/0056997
Monolithic Molded Flexible Electronic Assemblies Without Solder and Methods for Their Manufacture
Patent: 7,943,434 →
Application: 12/405,773 →
Publication: US 2009/0237901
Flexible Circuit Assemblies Without Solder and Methods for Their Manufacture
Patent: 8,193,042 →
Application: 12/581,711 →
Publication: US 2010/0096166
Car Top Carrier Lid Support
Application: 13/018,384 →
Publication: US 2011/0186608
Electronic Assemblies without Solder and Methods for their Manufacture
Application: 13/019,550 →
Publication: US 2011/0127080
Monolithic Molded Flexible Electronic Assemblies Without Solder and Methods for Their Manufacture
Patent: 8,093,712 →
Application: 13/094,105 →
Publication: US 2011/0199740
Electronic Assemblies Without Solder and Methods for Their Manufacture
Patent: 8,482,110 →
Application: 13/185,323 →
Publication: US 2012/0006589
Occam Process for Components Having Variations in Part Dimensions
Patent: 9,894,771 →
Application: 13/228,826 →
Publication: US 2011/0315302
Light-Emitting Diode Package Assembly
Application: 13/305,996 →
Publication: US 2012/0077293
Flexible Circuit Assembly Without Solder
Patent: 8,404,977 →
Application: 13/458,167 →
Publication: US 2012/0211265
Related Assignments (10)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 10, 2008
From: FJELSTAD, JOSEPH C.
To: OCCAM PORTFOLIO LLC
Reel/Frame 021223/0021 →
Assignment of Assignor's Interest Aug 6, 2008
From: GAMINI, NADER, MR.; FJELSTAD, JOSEPH C., MR.
To: OCCAM PORTFOLIO LLC
Reel/Frame 021345/0930 →
Assignment of Assignor's Interest Aug 20, 2008
From: FJELSTAD, JOSEPH C., MR.
To: OCCAM PORTFOLIO LLC
Reel/Frame 021419/0527 →
Assignment of Assignor's Interest Aug 20, 2008
From: FJELSTAD, JOSEPH C., MR.
To: OCCAM PORTFOLIO LLC
Reel/Frame 021419/0549 →
Assignment of Assignor's Interest Sep 3, 2008
From: FJELSTAD, JOSEPH C., MR.
To: OCCAM PORTFOLIO LLC
Reel/Frame 021477/0216 →
Assignment of Assignor's Interest Sep 15, 2008
From: FJELSTAD, JOSEPH C., MR.
To: OCCAM PORTFOLIO LLC
Reel/Frame 021528/0452 →
Assignment of Assignor's Interest Mar 30, 2009
From: FJELSTAD, JOSEPH C.
To: OCCAM PORTFOLIO LLC
Reel/Frame 022467/0285 →
Assignment of Assignor's Interest Nov 9, 2009
From: FJELSTAD, JOSEPH C., MR.
To: OCCAM PORTFOLIO LLC
Reel/Frame 023491/0152 →
Assignment of Assignor's Interest Apr 12, 2011
From: SAUTTER, CHRIS; ELLIOTT, JOHN MARK
To: YAKIMA PRODUCTS, INC.
Reel/Frame 026111/0102 →
Assignment of Assignor's Interest Mar 21, 2012
From: FJELSTAD, JOSEPH C
To: OCCAM PORTFOLIO LLC
Reel/Frame 027903/0476 →