Assignment of Assignor's Interest

Recorded: 2013-08-08 Pages: 2

Assignors

MAEDA, DAISUKE

Executed: 2013-06-14

JEONG, HEEWON

Executed: 2013-06-21

HAYASHI, MASAHIDE

Executed: 2013-06-24

Assignee

HITACHI AUTOMOTIVE SYSTEMS, LTD.

2520, TAKABA, HITACHINAKA-SHI, IBARAKI, JAPAN

Covered Property (1)

Sensor Module and Sensor System

Patent: 9,279,827 →

Application: 13/976,372 →

Publication: US 2013/0319075

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.