Patent Assignment
Reel/Frame 030991/0538
Assignment of Assignor's Interest
Recorded: 2013-08-12
Pages: 5
Assignors
XIE, CHUNLIN
Executed: 2013-06-19
SU, XILIN
Executed: 2013-06-19
HU, HONGPO
Executed: 2013-06-19
ZHANG, WANG
Executed: 2013-06-19
Assignees
SHENZHEN BYD AUTO R&D COMPANY LIMITED
PART B, 1/F BLDG#B2, YUCAN INDSTR. AREA, LANZHU RD, SHENZHEN EXPORT PROC ZN, SHENZHEN GRAND INDUST. ZN, SHENZHEN, 518118, CHINA
BYD COMPANY LIMITED
3009, BYD ROAD, PINGSHAN, SHENZHEN, 51118, CHINA
Covered Property
(1)
Substrate Structure, Method of Forming the Substrate Structure and Chip Comprising the Substrate Structure
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.