Assignment of Assignor's Interest

Recorded: 2013-08-13 Pages: 2

Assignors

KASHIYAMA, MASAHITO

Executed: 2013-07-25

NISHIYAMA, KOJI

Executed: 2013-07-26

Assignee

SOKUDO CO., LTD.

TENJINKITA-MACHI 1-1, TERANOUCHI-AGARU 4-CHOME, HORIKAWA-DORI, KAMIGYO-KU, KYOTO, 602-8585, JAPAN

Covered Property (1)

Substrate Processing Apparatus and Substrate Processing Method

Patent: 9,465,293 →

Application: 13/965,501 →

Publication: US 2014/0065309

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.