Patent Assignment
Reel/Frame 031001/0248
Assignment of Assignor's Interest
Recorded: 2013-08-13
Pages: 8
Assignors
DESAI, KISHOR
Executed: 2013-08-12
KACHRU, RAVINDER
Executed: 2013-08-12
PATEL, VIPULKUMAR
Executed: 2013-08-12
DAMA, BIPIN
Executed: 2013-08-12
SHASTRI, KALPENDU
Executed: 2013-08-12
PATHAK, SOHAM
Executed: 2013-08-12
Assignee
CISCO TECHNOLOGY, INC.
170 WEST TASMAN DRIVE, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Molded Glass Lid For Wafer Level Packaging Of Opto-Electronic Assemblies