IP Library Assignment 031125/0334
Patent Assignment
Reel/Frame 031125/0334

Change of Name

Recorded: 2013-08-30 Received: 2013-08-30 Pages: 9
Assignor
OKI SEMICONDUCTOR CO., LTD.
Executed: 2013-03-06
Assignee
LAPIS SEMICONDUCTOR CO., LTD.
2-4-8 SHIN-YOKOHAMA, KOHOKU-KU, YOKOHAMA-SHI, KANAGAWA, JPX, 193-8550, JAPAN
Covered Properties (2)
Method of Manufacturing Wiring Substrate Having Terminated Buses
Application: 11/440,113 →
Method of Terminating Bus, Bus Termination Resistor, and Wiring Substrate Having Terminated Buses and Method of Its Manufacture
Application: 10/079,464 →