Patent Assignment
Reel/Frame 031125/0334
Change of Name
Recorded: 2013-08-30
Received: 2013-08-30
Pages: 9
Assignor
OKI SEMICONDUCTOR CO., LTD.
Executed: 2013-03-06
Assignee
LAPIS SEMICONDUCTOR CO., LTD.
2-4-8 SHIN-YOKOHAMA, KOHOKU-KU, YOKOHAMA-SHI, KANAGAWA, JPX, 193-8550, JAPAN
Covered Properties
(2)
Method of Manufacturing Wiring Substrate Having Terminated Buses
Application:
11/440,113 →
Method of Terminating Bus, Bus Termination Resistor, and Wiring Substrate Having Terminated Buses and Method of Its Manufacture
Application:
10/079,464 →