Patent Assignment
Reel/Frame 031172/0933
Assignment of Assignor's Interest
Recorded: 2013-09-10
Pages: 6
Assignors
MAEDA, SHIGENOBU
Executed: 2013-08-20
KANG, HEE-SOO
Executed: 2013-08-20
SIM, SANG-PIL
Executed: 2013-08-21
HONG, SOO-HUN
Executed: 2013-08-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO,, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Including Protruding Insulation Portions Between Active Fins