Patent Assignment
Reel/Frame 031185/0657
Assignment of Assignor's Interest
Recorded: 2013-09-11
Pages: 8
Assignors
OH, GYU-HWAN
Executed: 2013-08-28
CHO, SUNG-LAE
Executed: 2013-08-28
BAE, BYOUNG-JAE
Executed: 2013-08-28
KIM, IK-SOO
Executed: 2013-08-28
IM, DONG-HYUN
Executed: 2013-08-29
PARK, DOO-HWAN
Executed: 2013-08-29
EOM, KYOUNG-HA
Executed: 2013-08-28
KWON, SUNG-UN
Executed: 2013-08-29
SHIN, CHUL-HO
Executed: 2013-08-29
JEONG, SANG-SUP
Executed: 2013-08-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming Semiconductor Device Having Self-Aligned Plug