Patent Assignment
Reel/Frame 031270/0695
Assignment of Assignor's Interest
Recorded: 2013-09-24
Pages: 4
Assignors
YAMAGUCHI, HIDETO
Executed: 2013-09-03
KOSUGI, TETSUYA
Executed: 2013-09-03
UENO, MASAAKI
Executed: 2013-09-03
Assignee
HITACHI KOKUSAI ELECTRIC INC.
4-14-1, SOTOKANDA,, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Thermocouple Support
Application:
14/033,880 →
Publication:
US 2014/0120636