Patent Assignment
Reel/Frame 031287/0797
Assignment of Assignor's Interest
Recorded: 2013-09-26
Pages: 7
Assignors
CHAUHAN, SHAKTI SINGH
Executed: 2013-08-29
MCCONNELEE, PAUL ALAN
Executed: 2013-08-29
GOWDA, ARUN VIRUPAKSHA
Executed: 2013-08-29
Assignee
GENERAL ELECTRIC COMPANY
1 RIVER ROAD, SCHENECTADY, NEW YORK, 12345
Covered Property
(1)
Embedded Semiconductor Device Package and Method of Manufacturing Thereof