IP Library Assignment 031296/0921
Patent Assignment
Reel/Frame 031296/0921

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2013-09-27 Received: 2013-09-27 Pages: 11
Assignors
LEE, HUNTEAK
Executed: 2013-09-13
CHI, HEEJO
Executed: 2013-09-17
KIM, KYUNGMOON
Executed: 2013-09-17
KIM, YOUNGCHUL
Executed: 2013-09-17
YEE, JAEHAK
Executed: 2013-09-17
MARIMUTHU, PANDI C.
Executed: 2013-09-18
ANDERSON, STEVE
Executed: 2013-09-25
LEE, KOOHONG
Executed: 2013-09-25
HOANG, LAN
Executed: 2013-09-26
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Application (1)
Semiconductor Device and Method of Bonding Semiconductor Die to Substrate in Reconstituted Wafer Form
App. No. 14/039,092