Patent Assignment
Reel/Frame 031299/0515
Corrective Assignment to Correct the Assignee Previously Recorded on Reel 031214 Frame 0407. Assignor(S) Hereby Confirms the Correct Country Address of the Assignee Is Republic of Korea.
Recorded: 2013-09-26
Pages: 5
Assignors
KANG, JAE WOOK
Executed: 2013-08-28
KIM, DO-GEUN
Executed: 2013-08-28
KIM, JONG KUK
Executed: 2013-08-28
JUNG, SUNG HUN
Executed: 2013-08-28
LEE, SEUNGHUN
Executed: 2013-08-28
Assignee
KOREA INSTITUTE OF MACHINERY AND MATERIALS
171 JANG-DONG, YUSEONG-GU, DAEJEON, 305-343, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Manufacturing Metal Wiring Buried Flexible Substrate by Using Plasma and Flexible Substrates Manufactured by the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 16, 2013
From: KANG, JAE WOOK; KIM, DO GEUN; KIM, JONG KUK; JUNG, SUNG HUN
To: KOREA INSTITUTE OF MACHINERY AND MATERIALS
Reel/Frame 031214/0407 →
Assignment of Assignor's Interest
Jan 27, 2021
From: KOREA INSTITUTE OF MACHINERY & MATERIALS
To: KOREA INSTITUTE OF MATERIALS SCIENCE
Reel/Frame 055137/0489 →