IP Library Assignment 031303/0357
Patent Assignment
Reel/Frame 031303/0357

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2013-09-27 Received: 2013-09-27 Pages: 10
Assignors
NA, DUK JU
Executed: 2013-09-25
ZHAO, XING
Executed: 2013-09-25
AUNG, KYAW OO
Executed: 2013-09-26
JI, LING
Executed: 2013-09-26
YONG, CHANG BUM
Executed: 2013-09-27
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Application (1)
INTEGRATED CIRCUIT THROUGH-SUBSTRATE VIA SYSTEM WITH A BUFFER LAYER AND METHOD OF MANUFACTURE THEREOF
App. No. 14/040,413