Patent Assignment
Reel/Frame 031308/0841
Assignment of Assignor's Interest
Recorded: 2013-09-30
Pages: 8
Assignors
LIU, YU-CHIA
Executed: 2013-09-26
CHU, CHIA-HUA
Executed: 2013-09-26
CHANG, KUEI-SUNG
Executed: 2013-09-26
CHENG, CHUN-WEN
Executed: 2013-09-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Wafer Level Sealing Methods with Different Vacuum Levels for Mems Sensors