Patent Assignment
Reel/Frame 031323/0873
Assignment of Assignor's Interest
Recorded: 2013-10-02
Pages: 4
Assignee
UNIMICRON TECHNOLOGY CORP.
NO. 38, HSING PONG RD., KWEI-SAN INDUSTRIAL ZONE,, TAOYUAN, TAIWAN
Covered Property
(1)
Packaging Carrier and Manufacturing Method Thereof and Chip Package Structure