IP Library Assignment 031329/0325
Patent Assignment
Reel/Frame 031329/0325

Assignment of Assignor's Interest

Recorded: 2013-10-02 Pages: 5
Assignors
OTREMBA, RALF
Executed: 2013-09-10
HOEGLAUER, JOSEF
Executed: 2013-09-10
CHONG, CHOOI MEI
Executed: 2013-09-10
Assignee
INFINEON TECHNOLOGIES AUSTRIA AG
SIEMENSSTRASSE 2, VILLACH, 9500, AUSTRIA
Covered Property (1)
Transistor arrangement with semiconductor chips between two substrates
Patent: 9,806,029 →
Application: 14/044,232 →
Publication: US 2015/0092375