Patent Assignment
Reel/Frame 031341/0207
Assignment of Assignor's Interest
Recorded: 2013-10-03
Pages: 4
Assignors
TSAI, PO-HAO
Executed: 2013-09-03
HSU, FENG-CHENG
Executed: 2013-09-03
CHENG, LI-HUI
Executed: 2013-09-03
HUNG, JUI-PIN
Executed: 2013-09-03
LIN, JING-CHENG
Executed: 2013-09-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Integrated Fan-Out Structure with Guiding Trenches in Buffer Layer