IP Library › Assignment 031351/0873
Patent Assignment
Reel/Frame 031351/0873

Assignment of Assignor's Interest

Recorded: 2013-10-04 Pages: 4
Assignors
GOLDA, DARIUSZ
Executed: 2013-10-03
KIM, HYEUN-SU
Executed: 2013-10-04
GASSEND, VALERIE
Executed: 2013-10-04
Assignee
KATEEVA, INC.
1430 O'BRIEN DRIVE, SUITE A, MENLO PARK, CALIFORNIA, 94025
Covered Property (1)
Low-Profile Mems Thermal Printhead Die Having Backside Electrical Connections
Patent: 8,815,626 →
Application: 14/036,869 →
Publication: US 2014/0024149
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Apr 4, 2019
From: KATEEVA, INC.
To: EAST WEST BANK
Reel/Frame 048806/0639 →
Release of Security Interest Jan 22, 2020
From: EAST WEST BANK, A CALIFORNIA BANKING CORPORATION
To: KATEEVA, INC.
Reel/Frame 051664/0802 →
Security Agreement Jan 23, 2020
From: KATEEVA, INC.
To: SINO XIN JI LIMITED
Reel/Frame 051682/0212 →
Security Interest Mar 17, 2022
From: KATEEVA, INC.; KATEEVA CAYMAN HOLDING, INC.
To: SINO XIN JI LIMITED
Reel/Frame 059382/0053 →
Security Interest Apr 19, 2022
From: KATEEVA CAYMAN HOLDING, INC.
To: HB SOLUTION CO., LTD.
Reel/Frame 059727/0111 →