IP Library Assignment 031354/0525
Patent Assignment
Reel/Frame 031354/0525

Assignment of Assignor's Interest

Recorded: 2013-10-07 Pages: 3
Assignors
TSAI, CHUN HSIUNG
Executed: 2013-10-01
SYUE, SEN-HONG
Executed: 2013-10-01
FANG, ZIWEI
Executed: 2013-10-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, R.O.C., TAIWAN
Covered Property (1)
Mechanism of Forming a Trench Structure
Patent: 9,396,986 →
Application: 14/046,384 →
Publication: US 2015/0099342