IP Library Assignment 031380/0856
Patent Assignment
Reel/Frame 031380/0856

Assignment of Assignor's Interest

Recorded: 2013-10-10 Pages: 2
Assignors
MANDEL, LARRY M.
Executed: 2005-01-05
LAUDICK, DAVID A.
Executed: 2005-01-05
Assignee
DELPHI TECHNOLOGIES, INC.
P. O. BOX 5052, M/C: 483-400-402, TROY, MICHIGAN, 48007-5052
Covered Property (1)
Overmolded Electronic Assembly with Insert Molded Heat Sinks
Patent: 7,230,829 →
Application: 11/045,211 →
Publication: US 2006/0171120
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 23, 2018
From: DELPHI TECHNOLOGIES, INC.
To: DELPHI TECHNOLOGIES IP LIMITED
Reel/Frame 045127/0546 →
Change of Name Sep 18, 2024
From: DELPHI TECHNOLOGIES IP LIMITED
To: BORGWARNER US TECHNOLOGIES LLC
Reel/Frame 068985/0968 →