Assignment of Assignor's Interest

Recorded: 2013-10-16 Pages: 7

Assignors

GOETZ, EDMUND

Executed: 2013-06-18

MEMMLER, BERND

Executed: 2013-09-13

MOLZER, WOLFGANG

Executed: 2013-07-12

MAHNKOPF, REINHARD

Executed: 2013-06-14

Assignee

INTEL IP CORPORATION

2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054

Covered Property (1)

Multiple Level Redistribution Layer for Multiple Chip Integration

Application: 13/931,899 →

Publication: US 2015/0001713

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.