Patent Assignment
Reel/Frame 031426/0384
Assignment of Assignor's Interest
Recorded: 2013-10-17
Pages: 4
Assignors
KUANG, HSUN-CHUNG
Executed: 2013-09-27
CHU, YEN-CHANG
Executed: 2013-10-03
HSIAO, CHENG-TAI
Executed: 2013-09-27
LIU, PING-YIN
Executed: 2013-09-27
CHAO, LAN-LIN
Executed: 2013-09-27
TU, YEUR-LUEN
Executed: 2013-09-27
TSAI, CHIA-SHIUNG
Executed: 2013-09-27
CHEN, XIAOMENG
Executed: 2013-09-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
3D Integrated Circuit and Methods of Forming the Same