Patent Assignment
Reel/Frame 031526/0209
Assignment of Assignor's Interest
Recorded: 2013-11-01
Pages: 2
Assignor
LEE, TU-CHEN
Executed: 2013-10-28
Assignee
ZEN VOCE CORPORATION
NO. 53, JINGGONG RD., SINFONG TOWNSHIP, HSINCHU COUNTY, TAIWAN
Covered Property
(1)
Apparatus and Method for Placing and Mounting Solder Balls on an Integrated Circuit Substrate