Patent Assignment
Reel/Frame 031584/0609
Assignment of Assignor's Interest
Recorded: 2013-11-12
Pages: 7
Assignors
HOHLFELD, OLAF
Executed: 2013-11-11
HOEGERL, JUERGEN
Executed: 2013-11-08
KESSLER, ANGELA
Executed: 2013-11-08
HOIER, MAGDALENA
Executed: 2013-11-08
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Semiconductor Package Comprising a Transistor Chip Module and a Driver Chip Module and a Method for Fabricating the Same