Patent Assignment
Reel/Frame 031597/0036
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2013-11-13
Received: 2013-11-13
Pages: 3
Assignee
BROADCOM CORPORATION
5300 CALIFORNIA AVENUE, IRVINE, CA, 92617-3038, UNITED STATES
Covered Application
(1)
Semiconductor Package Including Interposer with Through-Semiconductor Vias
App. No. 14/079,571
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