IP Library › Assignment 031609/0905
Patent Assignment
Reel/Frame 031609/0905

Assignment of Assignor's Interest

Recorded: 2013-11-15 Pages: 11
Assignors
SHIMIZU, KOZO
Executed: 2013-10-01
SAKUYAMA, SEIKI
Executed: 2013-10-02
MIYAJIMA, TOYOO
Executed: 2013-10-01
Assignee
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8588, JAPAN
Covered Property (1)
Method of Manufacturing Semiconductor Device Capable of Enhancing Bonding Strength Between Connection Terminal and Electrode
Patent: 9,305,875 →
Application: 14/063,866 →
Publication: US 2014/0210086
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 27, 2024
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 069454/0333 →
Assignment of Assignor's Interest Dec 17, 2025
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 073964/0516 →