Patent Assignment
Reel/Frame 031659/0781
Assignment of Assignor's Interest
Recorded: 2013-11-22
Pages: 4
Assignors
TSAI, TSUNG-HSIEN
Executed: 2013-01-21
CHU, HENG-CHENG
Executed: 2013-01-21
LIN, CHIEN-CHENG
Executed: 2013-01-21
CHIU, CHIH-HSIEN
Executed: 2013-01-21
CHUNG, HSIN-LUNG
Executed: 2013-01-21
CHU, YUDE
Executed: 2013-01-21
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD
NO. 123, SEC. 3, DA FOND ROAD, TANTZU, TAICHUNG, TAIWAN
Covered Property
(1)
Method of Manufacturing the Same Semiconductor Package