Patent Assignment
Reel/Frame 031666/0630
Assignment of Assignor's Interest
Recorded: 2013-11-25
Pages: 7
Assignor
TESSERA RESEARCH LLC
Executed: 2011-09-08
Assignee
TESSERA, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Microelectronic Assembly with Impedance Controlled Wirebond and Reference Wirebond
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 22, 2012
From: HABA, BELGACEM; MARCUCCI, BRIAN
To: TESSERA, INC.
Reel/Frame 028826/0030 →
Corrective Assignment to Correct the Name of Receiving Party from Tessera, Inc, to Tessera Research Llc. Previously Recorded on Reel 028826, Frame 0030.Assignors Hereby Confirms the Assignment.
Nov 21, 2013
From: HABA, BELGACEM; MARCUCCI, BRIAN
To: TESSERA RESEARCH LLC
Reel/Frame 031784/0056 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →