Patent Assignment
Reel/Frame 031702/0369
Assignment of Assignor's Interest
Recorded: 2013-12-03
Pages: 6
Assignors
KIM, JEONG-KYOUM
Executed: 2013-09-10
SONG, INDAL
Executed: 2013-09-10
CHOI, JUNGHWAN
Executed: 2013-09-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Memory Chip Package Having Optically and Electrically Connected Chips, Memory System Having the Same and Driving Method Thereof