Patent Assignment
Reel/Frame 031722/0544
Assignment of Assignor's Interest
Recorded: 2013-12-05
Pages: 6
Assignors
BARTLEY, GERALD K.
Executed: 2013-10-17
BECKER, DARRYL J.
Executed: 2013-10-22
GERMANN, PHILIP R.
Executed: 2013-10-14
HOVIS, WILLIAM P.
Executed: 2013-10-14
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Intelligent Chip Placement Within a Three-Dimensional Chip Stack