Patent Assignment
Reel/Frame 031759/0807
Assignment of Assignor's Interest
Recorded: 2013-12-11
Pages: 3
Assignors
BAI, LEI
Executed: 2013-11-28
LIU, XIONGBIAO
Executed: 2013-11-28
PENG, LEXIONG
Executed: 2013-11-28
Assignee
HUAWEI TECHNOLOGIES CO., LTD.
HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG DISTRICT, SHENZHEN, 518129, GUANGDONG, P.R., CHINA
Covered Property
(1)
Electronic Device, Electronic System, and Circuit Board Interconnection Architecture of the Same