Patent Assignment
Reel/Frame 031825/0803
Assignment of Assignor's Interest
Recorded: 2013-12-20
Pages: 4
Assignors
CHEN, SHENG-CHAU
Executed: 2013-12-04
CHOU, SHIH PEI
Executed: 2013-12-04
CHU, YEN-CHANG
Executed: 2013-12-04
CHOU, CHENG-HSIEN
Executed: 2013-12-04
HUANG, CHIH-HUI
Executed: 2013-12-04
TU, YEUR-LUEN
Executed: 2013-12-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Conductive Pad Structure for Hybrid Bonding and Methods of Forming Same