Assignment of Assignor's Interest

Recorded: 2013-12-20 Pages: 3

Assignors

IMAMURA, HISAYUKI

Executed: 2013-07-10

FUJITA, SUGURU

Executed: 2013-07-10

WATANABE, JUNICHI

Executed: 2013-07-10

Assignee

HITACHI METALS, LTD.

1-2-1, SHIBAURA, MINATO-KU, TOKYO, 105-8614, JAPAN

Covered Property (1)

Brazing Material, Brazing Material Paste, Ceramic Circuit Substrate, Ceramic Master Circuit Substrate, and Power Semiconductor Module

Patent: 9,780,011 →

Application: 14/127,476 →

Publication: US 2014/0126155

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.