Patent Assignment
Reel/Frame 031848/0118
Assignment of Assignor's Interest
Recorded: 2013-12-26
Pages: 4
Assignors
HO, KUAN-LIN
Executed: 2013-12-18
CHIU, SHENG-HSIANG
Executed: 2013-12-18
PAN, HSIN-YU
Executed: 2013-12-18
LIU, YU-CHIH
Executed: 2013-12-18
CHEN, CHIN-LIANG
Executed: 2013-12-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Lid Design for Heat Dissipation Enhancement of Die Package