Patent Assignment
Reel/Frame 031855/0633
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2013-12-27
Received: 2013-12-27
Pages: 4
Assignors
CHUA, LINDA PEI EE
Executed: 2013-08-27
DO, BYUNG TAI
Executed: 2013-08-27
TRASPORTO, ARNEL SENOSA
Executed: 2013-08-27
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Application
(1)
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TRANSFERABLE TRACE LEAD FRAME
App. No. 13/714,865
→