Patent Assignment
Reel/Frame 031862/0428
Assignment of Assignor's Interest
Recorded: 2013-12-31
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2013-12-23
YEE, KUO-CHUNG
Executed: 2013-12-24
LII, MIRNG-JI
Executed: 2013-12-18
LEE, CHIEN-HSUN
Executed: 2013-12-18
WU, JIUN YI
Executed: 2013-12-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TSMC)
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Wafer Level Package Structure and Method of Forming Same