Patent Assignment
Reel/Frame 031874/0547
Assignment of Assignor's Interest
Recorded: 2014-01-02
Pages: 7
Assignors
KANG, BO KYEONG
Executed: 2013-11-18
KIM, JAESEOK
Executed: 2013-11-18
YOON, BOUN
Executed: 2013-11-18
KIM, HOYOUNG
Executed: 2013-11-18
YOON, ILYOUNG
Executed: 2013-11-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Fabricationg the Same