Patent Assignment
Reel/Frame 031876/0945
Assignment of Assignor's Interest
Recorded: 2014-01-02
Pages: 4
Assignors
LEI, WEI-SHENG
Executed: 2013-09-23
EATON, BRAD
Executed: 2013-09-13
YALAMANCHILI, MADHAVA RAO
Executed: 2013-09-13
SINGH, SARAVJEET
Executed: 2013-09-23
KUMAR, AJAY
Executed: 2013-09-13
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Wafer Dicing Using Hybrid Multi-Step Laser Scribing Process with Plasma Etch