Patent Assignment
Reel/Frame 031886/0317
Assignment of Assignor's Interest
Recorded: 2014-01-03
Pages: 4
Assignors
LEE, DOO HWAN
Executed: 2013-12-17
CHUNG, YUL KYO
Executed: 2013-12-17
PARK, DAE HYUN
Executed: 2013-12-17
SHIN, YEE NA
Executed: 2013-12-17
LEE, SEUNG EUN
Executed: 2013-12-17
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
150, MAEYEONG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Having Electronic Component Embedded Therein and Method of Manufacturing the Same