IP Library Assignment 031889/0012
Patent Assignment
Reel/Frame 031889/0012

Assignment of Assignor's Interest

Recorded: 2014-01-03 Pages: 4
Assignors
SUTANTO, JEMMY
Executed: 2014-01-03
MUTHUSWAMY, JITENDRAN
Executed: 2014-01-03
Assignee
Covered Property (1)
Method for Creating and Packaging Three Dimensional Stacks of Biochips Containing Microelectro-Mechanical Systems
Patent: 8,653,642 →
Application: 13/711,118 →
Publication: US 2013/0134604