Patent Assignment
Reel/Frame 031894/0591
Assignment of Assignor's Interest
Recorded: 2014-01-06
Pages: 4
Assignor
EUN, BYUNG SOO
Executed: 2013-12-12
Assignee
SK HYNIX, INC.
2091 GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Fabricating an Inter Dielectric Layer in Semiconductor Device