Patent Assignment
Reel/Frame 031900/0758
Assignment of Assignor's Interest
Recorded: 2014-01-06
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Protrusion Bump Pads for Bond-on-Trace Processing