Patent Assignment
Reel/Frame 031901/0232
Assignment of Assignor's Interest
Recorded: 2014-01-06
Pages: 6
Assignors
LEE, JIN-HO
Executed: 2013-12-18
LEE, HEE-SEOK
Executed: 2013-12-18
YOU, SE-HO
Executed: 2013-12-19
HA, JEONG-OH
Executed: 2013-12-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Stack Type Semiconductor Package