IP Library Assignment 031908/0851
Patent Assignment
Reel/Frame 031908/0851

Assignment of Assignor's Interest

Recorded: 2014-01-07 Pages: 3
Assignors
LEE, MICHAEL
Executed: 2013-12-21
YAMAMOTO, TAKUJI
Executed: 2014-01-03
Assignee
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8588, JAPAN
Covered Property (1)
Interposer for Integrated Circuit Chip Package
Patent: 9,496,248 →
Application: 14/148,557 →
Publication: US 2015/0194413
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 27, 2024
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 069454/0333 →
Assignment of Assignor's Interest Dec 17, 2025
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 073964/0516 →