IP Library Assignment 031934/0470
Patent Assignment
Reel/Frame 031934/0470

Assignment of Assignor's Interest

Recorded: 2014-01-10 Pages: 4
Assignors
SATO, KENJI
Executed: 2013-11-05
ZANMA, MASAHIRO
Executed: 2013-11-05
Assignee
IBIDEN CO., LTD.
1, KANDA-CHO 2-CHOME, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property (1)
Wiring Board with Built-in Electronic Component and Method for Manufacturing the Same
Patent: 9,113,574 →
Application: 14/063,052 →
Publication: US 2014/0116763