Patent Assignment
Reel/Frame 031988/0766
Assignment of Assignor's Interest
Recorded: 2014-01-16
Pages: 3
Assignors
KAGESHIMA, YOSHIAKI
Executed: 2014-01-09
MUTO, DAISUKE
Executed: 2014-01-09
MOMOSE, KENJI
Executed: 2014-01-09
MIYASAKA, YOSHIHIKO
Executed: 2014-01-09
Assignee
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Sic Epitaxial Wafer and Method for Producing Same, and Device for Producing Sic Epitaxial Wafer
Application:
14/233,289 →
Publication:
US 2014/0145214